Monday, February 05, 2024

Business groups from Taiwan and the Czech Republic on Thursday signed a memorandum of understanding (MOU) on semiconductor cooperation.

Business groups from Taiwan and the Czech Republic on Thursday signed a memorandum of understanding (MOU) on semiconductor cooperation.

During a seminar on semiconductor investments in the Czech Republic held in Taipei, Taiwan semiconductor material supplier TOPOC Scientific Co. teamed up with the Taiwan Eastbound Alliance - Landing America (TeaLa) to ink the agreement with the Czech National Semiconductor Cluster (CNSC).

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