Monday, February 05, 2024

Business groups from Taiwan and the Czech Republic on Thursday signed a memorandum of understanding (MOU) on semiconductor cooperation.

Business groups from Taiwan and the Czech Republic on Thursday signed a memorandum of understanding (MOU) on semiconductor cooperation.

During a seminar on semiconductor investments in the Czech Republic held in Taipei, Taiwan semiconductor material supplier TOPOC Scientific Co. teamed up with the Taiwan Eastbound Alliance - Landing America (TeaLa) to ink the agreement with the Czech National Semiconductor Cluster (CNSC).

No comments:

New Zealand: 2026 opening dates for capped Working Holiday Schemes confirmed

The 2026 opening dates for capped Working Holiday Schemes (WHS) have now been confirmed. Once each scheme opens, applications will be open u...